On December 18, 2025, a team composed of multiple research backbones from the Intelligent Sensing and Communication Lab (ISCL) of Nanjing University, led by Associate Researcher Guo Jiacheng, was invited to visit Jiangsu Xinde Semiconductor Technology Co., Ltd., a leading domestic enterprise in advanced packaging. The visit aimed to deepen mutual understanding, focus on the collaborative innovation of cutting-edge chip design and advanced packaging technologies, and conduct in-depth technical exchanges and discussions on specific scientific research project cooperation cases.
At the beginning of the visit, Xinde Technology comprehensively demonstrated its development history, technological layout, and market position in the field of high-end packaging to the visiting team, laying a good foundation for subsequent technical discussions. Subsequently, the exchange entered the core technology sharing session. Xinde's technical experts first systematically elaborated on the principles, process characteristics, and cutting-edge applications of the two core packaging technologies, wire bonding (WB) and flip chip (FC), in the Technology Introduction I session. Then, in the Technology Introduction II session, they focused on introducing more advanced Wafer-Level Packaging (WLP) and Xinde's proprietary CAPIC technology platform, demonstrating its strong capabilities in achieving high density, high performance, and miniaturization of chips.
In the packaging case technology sharing session of Nanjing University's ISCL Laboratory, in response to the advanced packaging capabilities demonstrated by Xinde Technology, three core professional teams from the laboratory brought highly representative scientific research cases, engaging in point-to-point in-depth exchanges with Xinde Technology's technical experts. The High-Speed Interconnect Chip Design Team, Analog Chip Design Team, and Radio Frequency (RF) Chip Design Team respectively proposed customized needs for advanced packaging based on their respective specific research and development projects. The profound expertise of Nanjing University's ISCL Laboratory in front-end chip design perfectly complements Xinde Technology's leading technologies in back-end advanced packaging.
